Potting
Category: Special Processing
Description: Potting is the process of filling a complete electronic assembly with a solid or gelatinous compound for resistance to shock and vibration, and for exclusion of moisture and corrosive agents.
Selective potting is used to seal specified areas, where the potting is contained by a bondline or mechanical border.
Note: Most circuit board assembly houses coat assemblies with a layer of transparent conformal coating rather than potting. Conformal coating gives most of the benefits of potting, and is lighter and easier to inspect, test, and repair. See:
Component Software Load.
Major Cost Drivers -- PCBA Potting
Potting Cycle Time is comprised of masking the component or PCBA, mixing the potting material, applying it, curing it, inspecting it and touching it up.
Process Time = Masking Time + Mixing Time + Potting Time + Curing Time + Demasking Time + Inspect Time + Touch Up Time
Masking Time = Potting Location Quantity * Masking Tape Install Time
Potting Location Quantity = (PSO)
Masking Tape Install Time = (Machine variable)
Mixing Time = (Machine variable)/Batch Size
Potting Time = (Machine variable)
Curing Time = Load Time + Oven Time
Load Time = Oven Load Time + Oven Unload Time
Oven Load Time = (Machine variable)
Oven Unload Time = (Machine variable)
Oven Time = (Machine variable)*SEC_PER_HR
Demasking Time = Potting Location Quantity * Mask Removal Time
Mask Removal Time = (Machine variable)
Inspect Time = (Machine variable)
Touch Up Time = (Machine variable)
User Inputs –- PCBA Potting
PSO: Potting Location Quantity