Process Routing for Additive Manufacturing
The Additive Manufacturing routings available in aPriori include the following:
Selective Laser Sintering (SLS) Routing (under the Powder Bed Fusion routing node)
Direct Metal Laser Sintering (DMLS) Routings (under the Powder Bed Fusion routing node)
Stereolithography (SLA) Routing (under the Vat Polymerization routing node)
For all routings, Machining is included if the user specifies tolerances that are not achievable by the primary process.
In addition, DMLS routings require, by default, all the following:
Wire EDM from Machining
3-Axis Mill or 5-Axis Mill from Machining
Ultrasonic Cleaning from the Other Secondary Processes group
Stress Relief from the Heat Treatment process group
You can also manually include processes from Heat treatment, Surface Treatment, and Other Secondary Processes. And you can manually assign machining operations to individual GCDs.
Material Jetting Routing
Material Jetting includes the following processes:
Printing
Breakoff (removal of support structures)
The Powder Bed Fusion routings are shown below:
Selective Laser Sintering (SLS) Routing
Selective Laser Sintering includes the following processes:
Laser Sintering
Cleaning
Sieving
Powder Loading
Direct Metal Laser Sintering (DMLS) Routings
Direct Metal Laser Sintering includes the following processes:
Metal Sintering
Sieving
Powder Loading
Manual Base Removal or Power Tool Base Removal (removal of base support structures; must be manually included if Wire EDM is manually excluded—see below)
Breakoff (removal of support structures, except base support structures)
With metal sintering, parts are constructed on a base plate, a steel build platform positioned on the machine bed. The cost model assumes that the base plate is machined between runs.
By default, in order to model removal of the base plate from the base support structure, aPriori assigns to the Build Direction GCD the Base Plate Removal operation of the Wire EDM process (from the Machining process group). The Base Plate Removal operation is performed on the portion of the base plate that was occupied by the array of nested parts (that is, the smallest build-plate-aligned rectangle that encloses all the parts).
You can override the default, and instead model base plate removal with Manual Tool Base Removal or Power Tool Base Removal, by manually including one of these processes (under the Base Plate Removal node in the Additive Manufacturing process group). Manual Tool Base Removal and Power Tool Base Removal each have an operation (Base Removal Manual or Base Removal Power) that is performed on each Support Structure GCD.
In addition, in order to model base plate finishing subsequent to base plate removal, aPriori assigns Base Plate Facing (a child of 3-Axis Mill or 5-Axis Mill in the Machining process group) to the Build Direction GCD. Facing is performed on the entire surface area of the base plate (the product of machine Bed Length and Bed Width). Note that if wire EDM and facing are performed, facing appears first in the Manufacutring Process pane even though this doesn’t match the actual operation order.
DMLS routings also include Stress Relief from the Heat Treatment process group, as well as Ultrasonic Cleaning from the Other Secondary Processes process group.
Stereolithography (SLA) Routing
Stereolithography includes the following processes:
Resin Curing
Breakoff (removal of support structures)
Part Curing