Chemical Milling Options
This section covers the following setup options:
Bench Operation Options
The child operations of the Bench Operation process provide the following setup options:
• Final inspection time: defined on the Final Inspecting operation. By default, final inspection time is specified by the cost model variable defaultFinalInspectionTime (5 minutes in starting point VPEs). Users can override the default on a part-by-part basis with this setup option.
• Identing Time: defined on the Identing operation. By default, ident time is specified by the cost model variable defaultIdentingTime (45 seconds in starting point VPEs). Users can override the default on a part-by-part basis with this setup option.
• Spark Test Time: defined on the Spark Testing operation. By default, spark test time is specified by the cost model variable defaultSparkTestTime (2 minutes in starting point VPEs). Users can override the default on a part-by-part basis with this setup option.
Mask Spray Options
See Mask Spray Inputs in the Surface Treatment chapter of this Guide.
Mask Cure Options
The Mask Cure process provides the following setup option:
• Select maskant material used: by default, masking material is specified by the first entry of the lookup table tblMaskingMaterials. Users can override the default on a part-by-part basis with this setup option.
• Heated cure cycle: by default, the cure cycle is assumed to be heated. Users can override the default on a part-by-part basis with this setup option.
Scribe Option
The Scribe process provides the following setup option:
• Programming Cost: by default, programming cost is the product of the machine properties Programming Rate and Programming Time. With this setup option, users can override the default on a part-part basis, and specify the programming cost explicitly.
Etch Cell Options
The Etch Cell Cycle component-level operation provides the following setup option:
• Chemical Etch Rate: by default, the etch rate (see Etch Cell Formulas) is specified by the cost model variable defaultChemicalEtchingRate (0.0381mm/minute in starting point VPEs). Users can override the default on a part-by-part or etch-cell-by-etch-cell basis with this setup option.
If you edit a surface’s operation sequence in order to assign Chemical Milling to it, you can use the following GCD-level setup option to specify the depth to which the surface is to be etched:
• Assign Pocket Depth: enter the depth to which the surface is to be etched. This affects etching cycle time, as well as the arrangement of pockets into etch cell cycles. See Etch Cell Formulas.
If you don’t enter an etch depth, the cost model uses the depth of the shallowest form of type STAMP, if there is one; otherwise, the cost model uses 50% of the blank thickness.