Solder Jetting

Category: Surface Mount > Solder Application

Description: The Solder Jetting process deposits solder paste onto a PCB in the form of dots or lines, via a nozzle. Solder Jetting is one of two options for Solder Application, the other being Screen Printing which is the default (see Screen Printing). Solder Jetting is much less common so is off by default.

Major Cost Drivers -- PCBA Solder Jetting

Solder Jetting Cycle Time is a sum of the time to load the Printed Circuit Board (PCB) into the machine from the input conveyor, move the PCB to the lock position in the machine and clamp it down, look at the fiducials on the PCB, purge the solder paste from the nozzle and calibrate if required, deposit paste dots onto the PCB, and unload the PCB from the solder jetter and output rail.

Process Time = Load Time + Purge Time + Jet Time + Unload Time

Load Time = Input Conveyor Length/Input Conveyor Speed + Inside Conveyor Length/Inside Conveyor Speed + Clamp Time + Fiducial Check Time*3

Input Conveyor Length = (Machine variable)

Input Conveyor Speed = (Machine variable)

Inside Conveyor Length = (Machine variable)

Inside Conveyor Speed = (Machine variable)

Clamp Time = (Machine variable)

Fiducial Check Time = (Machine variable)

//A solder purge is required before solder jetting each PWB.

Purge Time = (Machine variable)

Jet Time = Dot Count / Jet Speed

Jet Speed = (Machine variable) / SEC_PER_HR

Dot Count = (PSO)

Unload Time = Output Conveyor Length/Output Conveyor Speed

Output Conveyor Length = (Machine variable)

Output Conveyor Speed = (Machine variable)

User Inputs –- PCBA Solder Jetting

PSO: Dot Count

Global Inputs: PCB Length, PCB Width, PCB Thickness, Pocket Existence Check