PEMS
Category: Prep Processes > Component Prep
Description: PEMS are Plastic Encapsulated Microcircuits. These microcircuits are susceptible to moisture exposure and therefore must be sealed in an airtight plastic bag with desiccant when not in use. In certain circumstances PEMS must be subjected to a bake process are required to be baked before installation onto the PCBA. There are different levels of sensitivity and these are determined by the vendor. Level 1 is common and does not require bake out. Level 2 through Level 5A have different levels of exposure that they can be out of these sealed bag or a dry box for.
Major Cost Drivers -- PCBA PEMS
PEMS Cycle Time is the time required to unpackage, bake (when required), and reseal PEMS components for the specific PCBA.
Process Time = (Unpackage Time + Bake Out Time + Reseal Time)*qty PEMS Part Types
Unpackage Time = (Machine variable)
Bake Out Time = (Machine variable)
Reseal Time = (Machine variable)
User Inputs –- PCBA PEMS
N/A