Description: Automated Xray Inspection (AXI) is similar to (but more costly than) Automated Optical Inspection (AOI), since it uses X-rays rather than visible light to automatically inspect features that are typically hidden from view.

For example, integrated circuits with packages such as BGAs (ball grid array) have connections that are underneath the chip and not visible, so that ordinary optical inspection is impossible. Because the connections are underneath the chip package there is a greater need to ensure that the manufacturing process is able to accommodate these chips correctly. Additionally, chips that use BGA packages tend to be larger ones with many connections. Therefore it is essential that all the connections are made correctly. AXI can identify find faults such as opens, shorts, insufficient solder, excessive solder, missing electrical parts, and mis-aligned components in these difficult-to-access locations..

AXI is often paired with the testing provided by Boundary Scan, InCircuit Test, and Functional Test.

Cycle Time for Automated Xray Inspection is the time required to load the PCBA into the machine, clamp the PCBA, check fiducials or tooling alignment holes, move to the x-ray locations, generate a results report, and unload the PCBA from the machine.

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