Adhesive Underfill
Category: Special Processing
Description: The manual or automated application of adhesive between the underside of a component and the PCB. This prevents the introduction of dust, debris, salt, etc. between the component and the PCB. The underfill also masks between the component body and PCB prior to conformal coat.
Major Cost Drivers -- PCBA Adhesive Underfill
The cycle time used to underfill components on a PCBA is the time to prepare the material(s), apply the adhesive through a syringe to the location and have it flow under the part, load into the oven, cure the material, and unload from the oven.
Process Time = Underfill Prep Time + Underfill Apply Time + Adhesive Curing Time
Underfill Prep Time = Material Prep Time (Machine variable)
Underfill Apply Time = Underfill Locations * Underfill Flow Time
Underfill Locations = Number of Underfill Locations (PSO)
Underfill Flow Time =(Machine variable)
Adhesive Curing Time = Oven Load Time + Oven Unload Time + Oven Time
Oven Load Time = (Machine variable)
Oven Unload Time = (Machine variable)
Oven Time = (Machine variable)
User Inputs –- PCBA Adhesive Underfill
PSO: Number of Underfill Locations