Adhesive Staking

Category: Special Processing

Description: The automated application of a staking adhesive to the PCBA to secure components to the PCB surface. For example, components exceeding a certain weight might be bonded to the PCB when no other mechanical support is used.

Major Cost Drivers -- PCBA Adhesive Staking

The Cycle Time for PCBA Adhesive Staking is the time to prepare the material(s), apply the adhesive through a syringe to the location, load into the oven, cure the material, and then unload from the oven.

Process Time = Adhesive Prep Time + Adhesive Apply Time + Adhesive Curing Time

Adhesive Prep Time =Adhesive Quantity* Material Prep Time

Adhesive Quantity = (PSO)

Material Prep Time = (Machine variable)

Adhesive Apply Time = Adhesive Locations*Adhesive Stake Time

Adhesive Locations = (PSO)

Adhesive Stake Time = (Machine variable)

Adhesive Curing Time = Load Time + Oven Time

Load Time = Oven Load Time + Oven Unload Time

Oven Load Time = (Machine variable)

Oven Unload Time = (Machine variable)

Oven Time = (Machine variable) *SEC_PER_HR

User Inputs – PCBA Adhesive Staking

PSO: Adhesive Quantity: The number of different adhesive types used.

PSO: Adhesive Locations: The number of locations to which to apply the adhesive.